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E-9000 Series of BG Tape

Supplier
LINTEC ADVANCED TECHNOLOGIES (TAIWAN), INC.
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Key Features

"BG Tape enables uniform grinding of high bumps wafers on the circuitry.  This tape disperses stress caused by bumps(heights > 100μm) and prevents dimples and cracks, when thinly grinding the wafer.
■ Unifom grinding of high bump wafer is achieved by dispersing stress put on the bumps while grinding.
■ We have developed a BG Tape that does not leave adhesive residue on the bump surface."

Last Update : 2015-06-19
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LINTEC ADVANCED TECHNOLOGIES (TAIWAN), INC.

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