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LC Tape was developed to provide protection and reinforcement to the backside of the chip in applications such as mounting flip chips.  LC Tpe helps reduce chipping during dicing and optical exposure to the device.  By adding greater reinforcement to thinner chips, LC Tape simplifies the conventional process in which liquid coation agents are used.  Further, LC Tape can be used with laser marking and molded packages.

Last Update : 2015-06-19
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LINTEC ADVANCED TECHNOLOGIES (TAIWAN), INC.

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