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Model No.
MP370/EP370-T
Supplier
ADVANCED SYSTEM TECHNOLOGY CO., LTD.
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Key Features

(1) patented a large area of high-density plasma source, as well as optimizing the efficiency of the exhaust and design In, Batch to Batch can control the uniformity of <± 3%, and to ensure the overall product yield (2) Advanced wafer backside helium cooling technology, with wafer Clamp base design, to create a very excellent wafer and temperature control capability (3) Optimization of the chamber and the exhaust system design, can effectively reduce PM Cycle time, and improve the productivity (10%) (4) has a good owner costs and operating costs, with the automatic transmission platform, but also can significantly improve plant efficiency and productivity. (5) the most compact floor space, which can effectively improve the use of clean room space (save 15%) (6) fully automated, intelligent PC operating system and user friendly interface, comprehensive intelligent debugging interlock protection designed to improve factory automation needs.

Last Update : 2017-10-17
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